JEDEC JESD 51-4
Thermal Test Chip Guideline (Wire Bond Type Chip)
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| Organization: | JEDEC |
| Publication Date: | 1 February 1997 |
| Status: | inactive |
| Page Count: | 14 |
scope:
This guideline describes design requirements for wire bond type semiconductor chips to be used for thermal resistance listing of IC packages. This document provides specific guidelines for chip design but allows flexibility in the materials and layout requirements.
Document History
June 1, 2019
THERMAL TEST CHIP GUIDELINE (WIRE BOND AND FLIP CHIP)
The purpose of this document is to provide a design guideline for thermal test chips used for integrated circuit (IC) and transistor package thermal characterization and investigations. The intent of...
JEDEC JESD 51-4
February 1, 1997
Thermal Test Chip Guideline (Wire Bond Type Chip)
This guideline describes design requirements for wire bond type semiconductor chips to be used for thermal resistance listing of IC packages. This document provides specific guidelines for chip...
February 1, 1997
Thermal Test Chip Guideline (Wire Bond Type Chip)
A description is not available for this item.
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