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NPFC - MIL-M-38510/753

MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC

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Organization: NPFC
Publication Date: 27 May 1994
Status: inactive
Page Count: 23
scope:

This specification covers the detail requirements for monolithic silicon, advanced CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation hardness assurance (RHA) are provided and are reflected in the complete Part or Identifying Number (PIN). The PIN shall be formulated in accordance with MIL-M-38510.

The device types shall be as follows:

Device type Circuit 01 To be included after dating 02 Dual D-type positive-edge triggered flip-flops with clear and set 03 To be included after dating 04 Dual JK positive-edge triggered flip-flops with clear and set 05 Dual JK negative-edge triggered flop-flops with clear and set 06 To be included after dating 07 Hex D-type flip-flops with master reset 08 Quad D-type flip-flops with reset

The device class shall be the product assurance level as defined in MIL-M-38510.

The case outlines shall be designated as follows:

Outline letter Case outline (see MIL-M-38510, appendix C) C D-1 (14-lead, .785" × .310" × .200"), dual-in-line package D F-2 (14-lead, .390" × .260" × .085"), flat package E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package 2 C-2 (20 terminal, .358" × .358" × .100"), square chip carrier package

Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Laboratory (RL/ERDS), Griffiss AFB, NY 13441-5700, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.

Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage range (VIN) - - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc DC output voltage range (VOUT) - - - - - - - - - - - - - - - - - - −0.5 V dc to VCC + 0.5 V dc Clamp diode current (IIK, IOK) - - - - - - - - - - - - - - - - - - ±20 mA DC output current (IOUT) - - - - - - - - - - - - - - - - - - - - - ±50 mA DC VCC or GND current (ICC, IGND) - - - - - - - - - - - - - - - - ±50 mA times the number of outputs Storage temperature range (TSTG) - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) - - - - - - - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - +300°C Thermal resistance, junction-to-case (ΘJC) - - - - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - +175°C Case operating temperature (TC) - - - - - - - - - - - - - - - - - −55°C to +125°C

Supply voltage range (VCC) - - - - - - - - - - - - - - - - - - - +3.0 V dc to +5.5 V dc Input voltage range (VIN) - - - - - - - - - - - - - - - - - - - +0.0 V dc to VCC Output voltage range (VOUT) - - - - - - - - - - - - - - - - - - +0.0 V dc to VCC Case operating temperature range (TC) - - - - - - - - - - - - - −55°C to +125°C Input low (VIL) maximum voltage - - - - - - - - - - - - - - - - 0.90 V dc at VCC = 3.0 V dc 1.35 V dc at VCC = 4.5 V dc 1.65 V dc at VCC = 5.5 V dc Input high (VIH) minimum voltage - - - - - - - - - - - - - - - - 2.10 V dc at VCC = 3.0 V dc 3.15 V dc at VCC = 4.5 V dc 3.85 V dc at VCC = 5.5 V dc Input rise and fall rate (tr, tf) maximum: - - - - - - - - - - - 8 ns/V at VCC = 3.6 V dc, 5.5 V dc Minimum setup time, data to CP (ts) Device type: 02 04 07 08 Unit VCC = 3.0 V; TC = +25°C, −55°C - - - - - - - - - - - - - - - - 4.0 6.5 6.5 4.5 ns TC = +125°C - - - - - - - - - - - - - - - 5.0 8.0 7.5 5.0 ns VCC = 4.5 V; TC = +25°C, −55°C - - - - - - - - - - - - - - - - 4.0 6.5 6.5 4.5 ns TC = +125°C - - - - - - - - - - - - - - - 5.0 8.0 7.5 5.0 ns Minimum hold time, data from CP (th) Device type: 02 04 07 08 Unit VCC = 3.0 V; TC = −55°C to +125°C - - - - - - - - - - - - - - 0.5 0.0 3.0 2.0 ns VCC = 4.5 V; TC = −55°C to +125°C - - - - - - - - - - - - - - 0.5 0.5 3.0 2.5 ns Minimum pulse width, CP (tW) Device type: 02 04 07 08 Unit VCC = 3.0 V; TC = +25°C, −55°C - - - - - - - - - - - - - - - - 5.0 5.0 5.5 5.0 ns TC = +125°C - - - - - - - - - - - - - - - 5.5 5.5 7.0 6.0 ns VCC = 4.5 V; TC = −55°C to +125°C - - - - - - - - - - - - - - 5.0 5.0 5.0 5.0 ns Minimum pulse width, [C bar][D bar], [S bar][D bar], or [M bar][R bar] (tw) Device type: 02 04 07 08 Unit VCC = 3.0 V; TC = +25°C, −55°C - - - - - - - 6.0 6.0 5.5 5.0 ns TC = +125°C - - - - - - - - - - - - - - - - - - - - - - - - - - 8.0 8.0 7.0 5.5 ns VCC = 4.5 V; TC = −55°C to +125°C - - - - - - - - - - - - - - 5.0 5.0 5.0 5.0 ns Minimum recovery time, [C bar][D bar], [S bar][D bar], or [M bar][R bar] to CP (trec) Device type: 02 04 07 08 Unit VCC = 3.0 V; TC = +25°C, −55°C - - - - - - - 0.5 0.5 2.5 1.5 ns TC = +125°C - - - - - - - - - - - - - - - - - - - - - - - - - - 0.5 0.5 3.0 1.5 ns VCC = 4.5 V; TC = −55°C to +125°C - - - - - - - - - - - - - - 0.5 0.5 2.0 1.5 ns

intended Use:

Microcircuits conforming to this specification are intended for original equipment design application and logistic support of existing equipment.

Document History

Microcircuits, Digital, Advanced CMOS, Flip-Flops, Monolithic Silicon, Positive Logic
A description is not available for this item.
October 26, 2018
Microcircuits, Digital, Advanced CMOS, Flip-Flops, Monolithic Silicon, Positive Logic
A description is not available for this item.
January 17, 2014
Microcircuits, Digital, Advanced CMOS, Flip-Flops, Monolithic Silicon, Positive Logic
A description is not available for this item.
April 2, 2009
Microcircuits, Digital, Advanced CMOS, Flip-Flops, Monolithic Silicon, Positive Logic
This specification covers the detail requirements for monolithic silicon, advanced CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation...
November 26, 2003
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC
This specification covers the detail requirements for monolithic silicon, advanced CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation...
August 5, 2002
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC
A description is not available for this item.
August 9, 1996
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC
A description is not available for this item.
November 23, 1994
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC
A description is not available for this item.
MIL-M-38510/753
May 27, 1994
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC
This specification covers the detail requirements for monolithic silicon, advanced CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and radiation...
January 29, 1993
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC
A description is not available for this item.
April 15, 1992
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC
A description is not available for this item.
May 14, 1990
MICROCIRCUITS, DIGITAL, ADVANCED CMOS, FLIP-FLOPS, MONOLITHIC SILICON, POSITIVE LOGIC
This specification covers the detail requirements for monolithic silicon, advanced, CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines, lead finishes, and...

References

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