DLA - SMD-5962-91647
MICROCIRCUIT, LINEAR, CMOS DUAL 12-BIT/14-BIT SERIAL D/A CONVERTERS, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 12 May 1995 |
| Status: | inactive |
| Page Count: | 14 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Integral non-linearity 01 AD7244 14 bit digital-to-analog converter ± 2 LSB
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-883 and as follows:
Outline letter Descriptive designator Terminals Package L GDIP3-T24 or CDIP4-T24 24 Dual-in-line
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Positive supply voltage (VDD) to AGND . . . . . . . . . . . . −0.3 V to +7.0 V Negative supply voltage (VSS) to AGND . . . . . . . . . . . . +0.3 V to −7.0 V AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V Analog output voltage (VOUT) to AGND . . . . . . . . . . . . VSS to VDD Voltage reference output (REF OUT) to AGND . . . . . . . . . −0.3 V to VDD + 0.3 V Voltage reference input (REF INA, REF INB) to AGND . . . . . −0.3 V to VDD + 0.3 V Digital inputs to DGND . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.3 V Storage temperature range . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 sec.) . . . . . . . . . . . . +300°C Power disipation to 75°C 2/ . . . . . . . . . . . . . . . . . 550 mW Thermal resistance, junction-to-case (θJC) . . . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (θJA) . . . . . . . . 60°C/W
Positive supply voltage range (VDD) . . . . . . . . . . . +4.75 V dc to +5.25 V dc Negative supply voltage (VSS) . . . . . . . . . . . . . . −4.75 V dc to −5.25 V dc Ambient operating temperature range . . . . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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