scope:

This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 OMA541SKB, MSK 541B, MSK 145B, MSK 146B High power, operational amplifier 02 OMA541SKCB High power, operational amplifier

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style U See figure 1 8 Dual-in-line (Z-tab power) X See figure 1 8 Flange mount Y See figure 1 8 Dual-in-line (power) Z See figure 1 6 Single-in-line

The lead finish shall be as specified in MIL-H-38534. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (±V_CC) . . . . . . . . . . . . . . . ±40 V dc Differential input voltage . . . . . . . . . . . . . ±V_CC Common mode input voltage . . . . . . . . . . . . . ±V_CC Maximum power dissipation (P_D) 2/ 3/ . . . . . . . . 125 W Storage temperature range . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . +300°C Thermal resistance, junction-to-case (θ_JC): Device type 01 . . . . . . . . . . . . . . . . . . 2.2°C/W Device type 02 . . . . . . . . . . . . . . . . . . 1.5°C/W Junction temperature (T_J) . . . . . . . . . . . . . +200°C

Supply voltage (±V_CC) . . . . . . . . . . . . . . . . . . ±34 V dc Ambient operating temperature range (T_A) . . . . . . . . −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.