scope:

This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-H-38534.

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 OMA541S High power operational amplifier

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 8 Flange mount Y See figure 1 8 Dual-in-line (power)

The lead finish shall be as specified in MIL-H-38534. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (±V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . ±40 V dc Differential input voltage . . . . . . . . . . . . . . . . . . . . . . . ±V_CC Common mode input voltage . . . . . . . . . . . . . . . . . . . . . . . ±V_CC Maximum power dissipation (P_D) 2/ 3/ . . . . . . . . . . . . . . . . . . 125 W Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (θ_JC) . . . . . . . . . . . . . . . 2.2°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . . . . +200°C

Supply voltage (±V_CC) . . . . . . . . . . . . . . . . . . . . . . . . . ±34 V dc Ambient operating temperature range (T_A) . . . . . . . . . . . . . . . . −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.