scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is be as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Delay Factor (K) Min Max 01 7C386A-X 4000 Gate CMOS FPGA 0.39 3.00 02 QL16X24B-0 4000 Gate CMOS FPGA 0.39 1.82 03 QL16X24B-1 4000 Gate CMOS FPGA 0.39 1.56

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 160 Quad flat package

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) ------------------------ −2.0 V dc to +7.0 V dc Programming supply voltage range (V_PP) ------------ −2.0 V dc to +13.5 V dc 2/ DC input voltage range ----------------------------------- −2.0 V dc to +7.0 V dc 2/ Maximum power dissipation -------------------------------- 2.5 W 3/ Lead temperature (soldering, 10 seconds) ----------------- +300°C Thermal resistance, junction-to-case (θ_JC): Case outline X ------------------------------------------ 5.3°C/W Junction temperature (T_J) ------------------------- +175°C 4/ Storage temperature range -------------------------------- −65°C to +150°C Data retention ------------------------------------------- 10 years (minimum)

Case operating temperature Range(T_C) ----------- −55°C to +125°C Supply voltage relative to ground(V_CC) --------- +4.5 V dc minimum to +5.5 V dc maximum Ground voltage(GND) ----------------------------------- 0 V dc Input high voltage (V_IH) ----------------------- 2.0 V dc minimum Input low voltage (V_IL) ------------------------ 0.8 V dc maximum

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ---------- 6/ percent

intended Use: