scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is be as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Delay Factor (K) Min Max 01 7C386A-X 4000 Gate CMOS FPGA 0.39 3.00 02 7C386A-0 4000 Gate CMOS FPGA 0.39 1.82 03 7C386A-1 4000 Gate CMOS FPGA 0.39 1.56

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level 8 microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 160 Quad flat package

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC)- - - - - - - - - - - - - - - - −2.0 V dc to +7.0 V dc Programming supply voltage range (V_pp)- - - - - - - - - - −2.0 V dc to +13.5 V dc 2/ DC input voltage range - - - - - - - - - - - - - - - - - −2.0 V dc to +7.0 V dc 2/ Maximum power dissapation - - - - - - - - - - - - - - - - 2.5 W 3/ Lead temperature (soldering, 10 seconds) - - - - - - - - +260°C Thermal resistance, junction-to-case (θ_JC): Case outline X - - - - - - - - - - - - - - - - - - - - 7.2° C/W Junction temperature (T_J) - - - - - - - - - - - - - - - - +175°C 4/ Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Data retention - - - - - - - - - - - - - - - - - - - - - 10 years (minimum)

Case operating temperature Range(T_C)- - - - - - - - - - - −55°C to +125°C Supply voltage relative to ground(V_CC)- - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) - - - - - - - - - - - - - - - - - - 0 V dc Input high voltage (V_IH)- - - - - - - - - - - - - - - - - 2.2 V dc minimum Input low voltage (V_IL) - - - - - - - - - - - - - - - - - 0.8 V dc maximum Input rise time (t_R)- - - - - - - - - - - - - - - - - - - 100 ns maximum Input fall time (t_F)- - - - - - - - - - - - - - - - - - - 100 ns maximum

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)- - - - - - 6/ percent

intended Use: