scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 29FCT818AT 8-bit diagnostic scan register, TTL compatible inputs and limited output voltage swing

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC) . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) . . . . . . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc 4/ DC output voltage range (V_OUT) . . . . . . . . . . . . . . . . . −0.5 V dc to V_CC + 0.5 V dc 4/ DC input clamp current (I_IK) (V_IN = −0.5) . . . . . . . . . . . . −20 mA DC output clamp current (I_OK) (V_OUT = −0.5 V and +7.0 V) . . . . ±20 mA DC output source current (I_OH) (per output) . . . . . . . . . . . −30 mA DC output sink current (I_OL) (per output) . . . . . . . . . . . +70 mA DC V_CC current (I_CC) . . . . . . . . . . . . . . . . . . . . . . ±268 mA Ground current (I_GND) . . . . . . . . . . . . . . . . . . . . . +588 mA Storage temperature range (T_STG) . . . . . . . . . . . . . . . . −65°C to +150°C Case temperature under bias (T_BIAS) . . . . . . . . . . . . . . . −65°C to +135°C Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . . . . . See MIL-STD-1835 Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . +175°C Maximum power dissipation (P_D). . . . . . . . . . . . . . . . . . 500 mW

Supply voltage range V_CC) . . . . . . . . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Input voltage range (V_IN) . . . . . . . . . . . . . . . . . . . +0.0 V dc to V_CC Output voltage range (V_OUT) . . . . . . . . . . . . . . . . . . +0.0 V dc to V_CC Maximum low level input voltage (V_IL) . . . . . . . . . . . . . 0.8 V Minimum high level input voltage (V_IH) . . . . . . . . . . . . . 2.0 V Case operating temperature range (T_C) . . . . . . . . . . . . . −55°C to +125°C Maximum input rise or fall rate (Δt/ΔV): (from V_IN = 0.3 V to 2.7 V, 2.7 V to 0.3 V) . . . . . . . . . 5 ns/V Maximum high level output current (I_OH) . . . . . . . . . . . . −3 mA Maximum low level output current (I_OL) . . . . . . . . . . . . . 20 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . XX percent 5/

intended Use: