scope:
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN is as shown in the following example:
Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) identify the circuit function as follows:
Device type Generic number Circuit function
01 HS-1840RH Radiation hardened DI single 16-channel
analog MUX/DEMUX with high impedance
analog input overvoltage protection
02 HS-1840ARH Radiation hardened DI single 16-channel
analog MUX/DEMUX with high impedance
analog input overvoltage protection
The device class designator is a single letter identifying the product assurance level as follows:
Device class Device requirements documentation
M Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Q or V Certification and qualification to MIL-PRF-38535
The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style
X CDIP2-T28 28 Dual-in-line
Y CDFP3-F28 28 Flat pack
The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.
Supply voltage between V+ and V−.............................. +40 V
Supply voltage between V+ and GND............................. +20 V
Supply voltage between V− and GND............................. −20 V
VREF to GND .................................................. +20 V
Digital input overvoltage range .............................. ((GND) − 4 V) ≤ VA ≤ ((VREF) + 4 V)
Analog input overvoltage range (power on/off):
Device type 01 ............................................. −25 V ≤ VS ≤ +25 V
Device type 02 ............................................. −35 V ≤ VS ≤ +35V
Storage temperature range .................................... −65°C to +150°C
Maximum package power dissipation (PD): 2/
Case X ..................................................... 1600 mW
Case Y ..................................................... 1400 mW
Lead temperature (soldering, 10 seconds) ..................... +275°C
Thermal resistance, junction-to-case (ΘJC) ................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (ΘJA):
Case X ..................................................... 83.1°C/W
Case Y ..................................................... 49.1°C/W
Positive supply voltage (V+) ...................................... +15V
Negative supply voltage (V−) ...................................... −15V
VREF .............................................................. 5 V dc
VAH ............................................................... 4.0 V dc
VAL ............................................................... 0.8 V dc
VEN ............................................................... 0.8 V dc
Ambient operating temperature range (TA) .......................... −55°C to +125°C
Radiation features: 3/
SEP effective let no upsets:
Device type 01 ................................................ 110 MeV/cm2/mg
Device type 02 ................................................ 120 MeV/cm2/mg
Total dose:
Device type 01 ................................................ > 200 kRads (Si)
Device type 02 ................................................ > 300 kRads (Si)
Dose rate upset:
Device type 01 ................................................ >1 × 108 Rad(Si)/s
Device type 02 ................................................ Not tested
Latch up ........................................................ None
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment) design applications, and logistics purposes.
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Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment) design applications, and logistics purposes.
Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing.
Device class Q devices will replace device class M devices.
Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes.
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