scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 HS-1840RH Radiation hardened DI single 16-channel analog MUX/DEMUX with high impedance analog input overvoltage protection.

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CDIP2-T28 28 Dual-in-line Y CDFP3-F28 28 Flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage between V+ and V− . . . . . . . . . . . 40 V dc Supply voltage between V+ and GND . . . . . . . . . . +20 V dc Supply voltage between V− and GND . . . . . . . . . . −20 V dc V_REF to GND . . . . . . . . . . . . . . . . . . . . . +20 V dc Digital input overvoltage range . . . . . . . . . . . ((GND)−4 V) ≤ V_A ≤ ((VREF)+4 V) Analog input overvoltage range (power on/off) . . . . −25 V ≤ VS ≤ +25 V Storage temperature range . . . . . . . . . . . . . . −65°C to +150°C Maximum package power dissipation (P_D): 2/ Case X . . . . . . . . . . . . . . . . . . . . . . . 1600 mW Case Y . . . . . . . . . . . . . . . . . . . . . . . 1400 mW Lead temperature (soldering, 10 seconds) . . . . . . . 275°C Thermal resistance, junction-to-case (θ_JC) . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (θ_JA): Case X . . . . . . . . . . . . . . . . . . . . . . . 83.1°C/W Case Y . . . . . . . . . . . . . . . . . . . . . . . 49.1°C/W

Positive supply voltage (V+) . . . . . . . . . . . . . . . . . . +15 V dc Negative supply voltage (V−) . . . . . . . . . . . . . . . . . . −15 V dc V_REF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V dc V_AH . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0 V dc V_AL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 V dc V_EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 V dc Ambient operating temperature range (T_A) . . . . . . . . . . . . −55°C to +125°C Radiation features: 3/ SEP effective let no upsets . . . . . . . . . . . . . . . . . 110 MeV/cm²/mg Total dose . . . . . . . . . . . . . . . . . . . . . . . . . . >200 kRad(SI) Dose rate upset . . . . . . . . . . . . . . . . . . . . . . . >1 × 10⁸ Rad(SI)/s Latch-up . . . . . . . . . . . . . . . . . . . . . . . . . . . None

intended Use: