DLA - SMD-5962-78013 REV H
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
| Organization: | DLA |
| Publication Date: | 20 May 1992 |
| Status: | inactive |
| Page Count: | 8 |
scope:
This drawing describes device requirements for class H hybrid microcircuits processed in accordance with MIL-H-38534.
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 0002 Current amplifier
The case outline(s) shall be as designated in MIL-STD-1835, and as follows: 1/
Outline letter Descriptive designator Terminals Package style G MACY1-X8 8 can X See figure 1 8 can
Supply voltage range (VS) . . . . . . . . . . . . . . ±22 V dc Input voltage range . . . . . . . . . . . . . . . . . ±22 V dc Storage temperature range . . . . . . . . . . . . . . −65° to +150°C Power dissipation (PD), TA = +25°C . . . . . . . . . 600 mW 2/ Lead temperature (soldering, 10 seconds). . . . . . . +300°C Thermal resistance, junction-to-case (ΘJC) . . . . . 40°C/W Junction temperature (TJ) . . . . . . . . . . . . . . +75°C
Ambient operating temperature range (TA) . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for original equipment design applications and logistic support of existing equipment.
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