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DLA - SMD-5962-78013 REV M

MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM

inactive
Organization: DLA
Publication Date: 9 February 2006
Status: inactive
Page Count: 10
scope:

This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Document History

August 2, 2018
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or...
November 7, 2011
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or...
June 28, 2010
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or...
SMD-5962-78013 REV M
February 9, 2006
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are...
February 23, 2004
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
A description is not available for this item.
June 22, 1998
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
This drawing documents one product assurance class, class H (high reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).
March 29, 1994
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
A description is not available for this item.
May 20, 1992
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
This drawing describes device requirements for class H hybrid microcircuits processed in accordance with MIL-H-38534. The complete PIN shall be as shown in the following example: The device type(s)...
May 9, 1990
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
A description is not available for this item.
February 13, 1987
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
A description is not available for this item.
August 30, 1985
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
A description is not available for this item.
December 14, 1984
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
A description is not available for this item.
April 22, 1983
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
A description is not available for this item.
January 4, 1982
MICROCIRCUIT, HYBRID, LINEAR, HIGH CURRENT AMPLIFIER, THICK/THIN FILM
A description is not available for this item.

References

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