scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN), Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness-assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 Specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 87C196KC 16 MHz CHMOS 16-bit, microcontroller with 16k bytes of on-chip EPROMS

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X P-AC(68-pin, 1.180" × 1.180" × .345")pin grid array package1/ Y See figure 1(68-terminal, 1.640" × 1.640" × .106") ceramic quad flat package 1/

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Voltage on any pin with respect to ground - - - - - - - −0.5 V to +7.0 V Power dissipation (P_D) - - - - - - - - - - - - - - - - 1.5 W Lead temperature (soldering 10 seconds) - - - - - - - - 265°C Thermal resistance, junction-to-case (θ_JC)- - - - - - - See MIL-M-38510, appendix C Case Y - - - - - - - - - - - - - - - - - - - - - - 9.0°C/W Junction temperature (T_J) - - - - - - - - - - - - - - - 200°C

Case operating temperature range - - - - - - - - - - - −55°C to +125°C Supply voltage, V_CC - - - - - - - - - - - - - - - - - - +5.0V ±10% Analog supply voltage, V_REF - - - - - - - - - - - - - - +5.0V ±10% Oscillator frequency, F_OSC - - - - - - - - - - - - - - 3.5 to 16 MHz

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - XX percent 3/

intended Use: