scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 87C196KC 16 MHz CHMOS 16-bit, microcontroller with 16 k bytes of on-chip EPROM and 512 byte register file. 02 87C196KD 16 MHz CHMOS 16-bit, microcontroller with 32 k bytes of on-chip EPROM and 1024 byte register RAM. 03 87C196KD 20 MHz CHMOS 16-bit microcontroller with 32 k bytes of on-chip EPROM and 1024 byte register RAM.

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CMGA3-P68 68 Pin grid array 1/ Y See figure 1 68 Ceramic quad flat 1/

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to +150°C Voltage on any pin with respect to ground range . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc Power dissipation (P_D) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W Lead temperature (soldering, 10 seconds) . . . . . . . . . . . . . . . . . . . . . . . +265°C Thermal resistance, junction-to-case (ΘJ_C): Case X . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case Y . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9.0°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C

Case operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to +125°C Supply voltage range V_CC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.0 V dc ±10% Analog supply voltage, V_REF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5.0 V dc ±10% Oscillator frequency, F_OSC Device 01, 02 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 to 16 MHz Device 03 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.5 to 20 MHz

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . . . . . . . . . . . . . 80 percent

intended Use: