DLA - SMD-5962-90927 REV B
MICROCIRCUIT, LINEAR, ANALOG-TO-DIGITAL CONVERTER, VIDEO, 8-BIT, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 17 July 1995 |
| Status: | inactive |
| Page Count: | 17 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) Levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function INL/DNL (TA = +25°C) 01 AD9048T 8-bit video analog-to-digital converter 0.5 LSB 02 AD9048S 8-bit video analog-to-digital converter 0.75 LSB 03 TS83048 8-bit video analog-to-digital converter 0.65 LSB
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X see figure 1 28 dual-in-line, side brazed 3 CQCC1-N28 28 square leadless chip carrier
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
VCC to DGND. . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +7.0 V dc AGND to DRND . . . . . . . . . . . . . . . . . . . . . −0.5 V dc to +0.5 V dc VEE to AGND. . . . . . . . . . . . . . . . . . . . . . +0.5 V dc to −7.0 V dc VIN, VRT or VRB, to AGND . . . . . . . . . . . . . . . +0.5 V to VEE Differential reference voltage (VRT to VRB). . . . . . −2.2 V dc to +2.2 V dc CONV, NMINV or NLINV to DGND . . . . . . . . . . . . . −0.5 V dc to +5.5 V dc Applied output voltage to DGND . . . . . . . . . . . . −0.5 V dc to +5.5 V dc 2/ Applied output current, externally forced . . . . . . −1.0 mA to +6.0 mA3/4/ Output short-circuit duration. . . . . . . . . . . . . 1.0 s 5/ Junction temperature . . . . . . . . . . . . . . . . . +175°C Thermal resistance, junction-to-case (θJC) Case outline X . . . . . . . . . . . . . . . . . . . 15°C/W Case outline 3 . . . . . . . . . . . . . . . . . . . 21°C/W Lead temperature, (soldering, 10 sec). . . . . . . . . +300°C Storage temperature range. . . . . . . . . . . . . . . −65°C to +150°C
Ambient operating temperature range (TA) . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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