scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices met the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function INL/DNL(T_A = +25°C) 01 AD9048T 8-bit video analog-to-digital converter 0.5 LSB 02 AD9048S 8-bit video analog-to-digital converter 0.75 LSB 03 TS83048 8-bit video analog-to-digital converter 0.65 LSB

The device class designator is a single letter identifying the product assurance level as follows:

Device Class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 28 dual-in-line, side brazed 3 CQCC1-N28 28 square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

V_CC to DGND....................................................... −0.5 V dc to +7.0 V dc AGND to DGND...................................................... −0.5 V dc to +0.5 V dc V_EE to AGND....................................................... +0.5 V dc to −7.0 V dc V_IN, V_RT or V_RB to AGND........................................... +0.5 V to V_EE Differential reference voltage (V_RT to V_RB)........................ −2.2 V dc to +2.2 V dc CONV, NMINV or NLINV to DGND...................................... −0.5 V dc to +5.5 V dc Applied output voltage to DGND.................................... −0.5 V dc to +5.5 V dc2/ Applied output current, externally forced......................... −1.0 mA to +6.0 mA 3/ 4/ Output short-circuit duration..................................... 1.0s 5/ Junction temperature.............................................. +175°C Thermal resistance, junction-to-case (θ_JC) Case outline X.................................................. 15°C/W Case outline 3.................................................. 21°C/W Lead temperature, (soldering, 10 sec)............................. +300° C Storage temperature range......................................... −65°C to +150°C

Ambient operating temperature range (T_A).......................... −55°C to + 125°C

intended Use: