scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein).Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function INL/DNL (T_A = +25°C) 01 AD9048T 8-bit video analog-to-digital converter 0.5 LSB 02 AD9048S 8-bit video analog-to-digital converter 0.75 LSB

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X (28-lead, 1.490" × .610" × .225"), dual-in-line, side brazed package, see figure 1 3 C-4 (28-terminal, .460" × .358" × .100"), leadless chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

V_CC to DGND - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc AGND TO DGND - - - - - - - - - - - - - - - - - - - −0.5 V dc to +0.5 V dc V_EE to AGND - - - - - - - - - - - - - - - - - - - - +0.5 V dc to −7.0 V dc V_IN, V_RT or V_RB to AGND - - - - - - - - - - - - - - +0.5 V to V_EE Differential reference voltage (V_RT to V_RB) - - - - −2.2 V dc to +2.2 V dc CONV, NMINV or NLINV to DGND - - - - - - - - - - - −0.5 V dc to +5.5 V dc Applied output voltage to DGND - - - - - - - - - - −0.5 V dc to +5.5 V dc 2/ Applied output current, externally forced - - - - - −1.0 mA to +6.0 mA 3/ 4/ Output short-circuit duration - - - - - - - - - - - 1.0 s 5/ Junction temperature (T_J) - - - - - - - - - - - - - +175°C Thermal resistance, junction-to-case (Θ_JC) Case outline X - - - - - - - - - - - - - - - - - 15°C/W Case outline 3 - - - - - - - - - - - - - - - - - 21°C/W Lead temperature, (soldering, 10 seconds) - - - - - +300°C Storage temperature range - - - - - - - - - - - - - −65°C to +150°C

Ambient operating temperature range (T_A) - - - - - - - - −55°C to +125°C

intended Use: