IPC - TM-650 2.4.42.1
High Temperature Mechanical Strength Retention of Adhesives
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 March 1988 |
| Status: | active |
| Page Count: | 1 |
scope:
The object of this test is to determine the component hold-down capability of the adhesive material at wave soldering temperatures due to material softening or degradation. Test coupons are assembled using the adhesive material and 1206 size chip resistors. The test coupons are preheated then floated on a solder pot, after which the loss of any components is noted.
Document History
TM-650 2.4.42.1
March 1, 1988
High Temperature Mechanical Strength Retention of Adhesives
The object of this test is to determine the component hold-down capability of the adhesive material at wave soldering temperatures due to material softening or degradation. Test coupons are assembled...