scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for monolithic microcircuits to be processed in accordance with the class H requirements of MIL-PRF-38534. A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN).

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identity the circuit function as follows:

Device type Generic number Circuit function Access time 01 WMS512K8-120 512k × 8 bit SRAM 120 ns 02 WMS512K8-100 512k × 8 bit SRAM 100 ns 03 WMS512K8-85 512k × 8 bit SRAM 85 ns 04 WMS512K8-70 512k × 8 bit SRAM 70 ns 05 ACT-S512K8N-055,WMS512K8-55 512k × 8 bit SRAM 55 ns 06 ACT-S512K8N-045,WMS512K8-45 512k × 8 bit SRAM 45 ns 07 ACT-S512K8N-035,WMS512K8-35 512k × 8 bit SRAM 35 ns 08 ACT-S512K8N-025,WMS512K8-25 512k × 8 bit SRAM 25 ns 09 ACT-S5l2K8N-020,WMS512K8-20 512k × 8 bit SRAM 20 ns 10 ACT-S512K8N-017,WMS512K8-17 512k × 8 bit SRAM 17 ns 11 WMS512K8M-45 512k × 8 bit SRAM 45 ns 12 WMS512K8M-35 512k × 8 bit SRAM 35 ns 13 WMS512K8M-25 512k × 8 bit SRAM 25 ns

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H Certification and qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style T See figure 1 32 SOJ, ceramic, evolutionary pinout X See figure 1 36 Flatpack, ceramic Y See figure 1 32 DIP, ceramic, single cavity Z See figure 1 36 SOJ, ceramic U See figure 1 36 Flatpack, ceramic

The lead finish shall be as specified in MIL-PRF-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) ...................... −0.5 V dc to + 7.0 V dc Signal voltage range (V_g) ....................... −0.5 V dc to V_CC +0.5 Power dissipation (P_D) .......................... 1.1 W max Storage temperature range ....................... −65°C to +150°C Lead temperature (soldering, 10 seconds) ........ +300°C Junction temperature (T_J) ....................... 150°C

Supply voltage range (V_CC) ...................... +4.5 V dc to +5.5 V dc Input low voltage range (V_IL) ................... −0.3 V dc to +0.8 V dc Input high voltage range (V_IH) .................. +2.2 V dc to V_CC +0.3 V dc Output low voltage, maximum (V_OL) ............... +0.4 V dc Output high voltage, minimum (V_OH) .............. +2.4 V dc Ambient operating temperature range (T_A) ........ −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.