scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Bin speed 01 1020A 2000 gate, field programmable gate array 186 ns 02 1020A-1 2000 gate, field programmable gate array 158 ns 03 1020B 2000 gate, field programmable gate array 168.2 ns 04 1020B-1 2000 gate, field programmable gate array 142.9 ns 05 RH1020 2000 gate, field programmable gate array 168.2 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X CQCC2 - J44 44 J-lead chip carrier Y CQCC2 - J68 68 J-lead chip carrier Z CQCC2 - J84 84 J-lead chip carrier U CMGA15 - P85 84 Pin grid array 1/ T CQCC1 - F84 84 Unformed lead chip carrier M See figure 1 84 Unformed lead chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

DC supply voltage range (V_DD) -------------------- −0.5 V dc to +7.0 V dc Input voltage range (V_I) - ----------------------- −0.5 V dc to V_DD + 0.5 V dc Output voltage range (V_O) ------------------------ −0.5 V dc to V_DD + 0.5 V dc I/O source sink current (I_O) --------------------- ±20 mA Storage temperature range (T_STG) ----------------- −65°C to + 150°C Lead temperature (soldering, 10 seconds) --------- 300°C Thermal resistance, junction-to-case (θ_JC) Case outline X, Y, Z, U, T ----------------------- See MIL-STD-1835 Case outline M ----------------------------------- 10°C/W 3/ Maximum junction temperature (T_J) ---------------- +150°C

Supply voltage (V_DD) ----------------------------- +4.5 V dc to +5.5 V dc Case operating temperature range (T_C) ------------ −55°C to +125°C

Total Dose ---------------------------------------- 300K rads (maximum) 4/

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)--------100 percent 5/

intended Use: