DLA - SMD-5962-94611
MICROCIRCUIT, HYBRID, MEMORY, DIGITAL, 512K X 32-BIT, STATIC RANDOM ACCESS MEMORY, CMOS
| Organization: | DLA |
| Publication Date: | 13 November 1995 |
| Status: | inactive |
| Page Count: | 21 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-PRF-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function Access time 01 WS512K32-1200 512K × 32 SRAM 120 ns 02 WS512K32-1000 512K × 32 SRAN 100 ns 03 WS512K32-850 512K × 32 SRAM 85 ns 04 WS512K32-700 512K × 32 SRAN 70 ns
This device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation H or K Certification and qualification to MIL-PRF-38534
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X See figure 1 66 Hex-in-Line, single cavity, with standoffs Y See figure 1 68 Ceramic, quad flatpack, single cavity
The lead finish shall be as specified in MIL-PRF-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range (VCC) . . . . . . . . . . . . −0.5 V dc to +7.0 V dc Signal voltage range (Vg) . . . . . . . . . . . . . −0.5 V dc to VCC +0.5 V dc Power dissipation (PD) . . . . . . . . . . . . . . 2.2 W Storage temperature range . . . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds) . . . . . +300°C Junction temperature (Tj) . . . . . . . . . . . . . +150°C
Supply voltage range (VCC) . . . . . . . . . . . . +4.5 V dc to +5.5 V dc Input low voltage range (VIL) . . . . . . . . . . . −0.3 V dc to +0.8 V dc Input high voltage range (VIH . . . . . . . . . . . +2.2 V dc to VCC +0.3 V dc Output low voltage maximum (VOL) . . . . . . . . . +0.4 V dc Output high voltage, minimum (VOH) . . . . . . . . +2.4 V dc Ambient operating temperature range (TA) . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History