DLA - SMD-5962-96643 REV B
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, HEX BUFFER, MONOLITHIC SILICON
inactive
| Organization: | DLA |
| Publication Date: | 2 February 2004 |
| Status: | inactive |
| Page Count: | 23 |
Document History
March 24, 2021
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, HEX BUFFER, MONOLITHIC SILICON
Scope.
This drawing documents two product assurance class levels consisting of high reliability device classes Q and space application device class V. A choice of case outlines and lead finishes are...
July 24, 2014
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, HEX BUFFER, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability device classes Q and space application device class V. A choice of case outlines and lead finishes are...
SMD-5962-96643 REV B
February 2, 2004
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, HEX BUFFER, MONOLITHIC SILICON
A description is not available for this item.
December 12, 1997
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, HEX BUFFER, MONOLITHIC SILICON
This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535...
December 27, 1995
MICROCIRCUIT, DIGITAL, RADIATION HARDENED CMOS, HEX BUFFER, MONOLITHIC SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and...