DLA - SMD-5962-79013 REV D
MICROCIRCUIT, DIGITAL, CMOS, BUFFERED TRIPLE 3-INPUT NAND GATE, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 4 February 1994 |
| Status: | inactive |
| Page Count: | 10 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 4023B NAND gates 02 14023B NAND gates
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage range - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to +18 V dc Input voltage range - - - - - - - - - - - - - - - - - - - - - - - - - - - - - −0.5 V dc to VDD +0.5 V dc Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (PD) 1/ - - - - - - - - - - - - - - - - - - - - - - 500 mW dc Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - - - - - −300°C Thermal resistance, junction to case (θJC) - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Junction temperature (TJ)- - - - - - - - - - - - - - - - - - - - - - - - - - - +175°C
Supply voltage range - - - - - - - - - - - - - - - - - - - - - - - - - - - - - +3.0 V dc to +15 V dc Case operating temperature range - - - - - - - - - - - - - - - - - - - - - - - −55°C to 125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
Document History