scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 HCPL-5601 High speed single channel optocoupler

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation H or K Certification and qualification to MIL-H-38534

The case outline(s) shall be, as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P CDIP2-T8 8 Dual-in-line X See figure 1 8 Dual-in-line Y See figure 1 8 Dual-in-line

The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC) 1/ - - - - - - - - - - - - - 7.0 V dc Peak forward input current (t ≤ 1.0 ms) - - - - - 40 mA Average input forward current (I_FAVG)- - - - - - - 20 mA Reverse input voltage (V_R) - - - - - - - - - - - - 5.0 V dc Output current (I_o) - - - - - - - - - - - - - - - 25 mA Output voltage (V_o) - - - - - - - - - - - - - - - 7.0 V dc Enable input voltage (V_E) - - - - - - - - - - - - 5.5 V dc Output power dissipation - - - - - - - - - - - - - 40 mW Input power dissipation - - - - - - - - - - - - - 35 mW Total package power dissipation (P_D) - - - - - - - 350 mW Lead temperature (soldering, 10 seconds) - - - - - +260°C Storage temperature range - - - - - - - - - - - - −65°C to +150°C Thermal resistance, junction-to-case (θ_JC): Case outline P - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case outlines X and Y - - - - - - - - - - - - - 28°C/W Junction temperature (T_J) - - - - - - - - - - - - +175°C

Low level input current range (I_FL) - - - - - - - 0 to 250 µA High level input current range (I_FH) 2/ - - - - - 12.5 mA to 16 mA Output supply voltage rang: (V_CC) - - - - - - - - 4.5 V dc to 5.5 V dc Fan out, (N) - - - - - - - - - - - - - - - - - - - 6.0 TTL loads maximum High-level enable voltage (V_EH) 3/ - - - - - - - - 2.0 V dc to V_CC Low-level enable voltage (V_EL) 3/ - - - - - - - - 0 V dc to 0.8 V dc Operating temperature range (T_A) - - - - - - - - - −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistic purposes.