scope:

This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G (lowest high reliability), class H (high reliability), and class K, (highest reliability) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 HCPL-5601, HCPL-560K, 66056-005, High speed single channel optocoupler 66056-300

This device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device performance documentation D, E, G, H, or K Certification and qualification to MIL-PRF-38534

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P CDIP2-T8 8 Dual-in-line X See figure 1 8 Dual-in-line Y See figure 1 8 Dual-in-line

The lead finish shall be as specified in MIL-PRF-38534.

Supply voltage (V_CC) 1/ ....................................... 7.0 V dc Peak forward input current (t ≤ 1.0 ms) ....................... 40 mA Average input forward current (I_FAVG) ......................... 20 mA Reverse input voltage (V_R) .................................... 5.0 V dc Output current (I_O) ........................................... 25 mA Output voltage (V_O) ........................................... 7.0 V dc Enable input voltage (V_E) ..................................... 5.5 V dc Output power dissipation ...................................... 40 mW Input power dissipation ....................................... 35 mW Total package power dissipation (P_D) .......................... 350 mW Lead temperature (soldering, 10 seconds) ...................... +260°C Storage temperature range ..................................... −65°C to +150°C Thermal resistance, junction-to-case (θ_JC): Case outline P ............................................... See MIL-STD-1835 Case outlines X and Y ........................................ 28°C/W Junction temperature (T_J) ..................................... +175°C

Low level input current range (I_FL) ........................... 0 to 250 µA High level input current range (I_FH) 2/ ....................... 12.5 mA to 16 mA Output supply voltage range (V_CC) ............................. 4.5 V dc to 5.5 Vdc Fan out, (N) .................................................. 6.0 TTL loads maximum High-level enable voltage (V_EH) 3/ ............................ 2.0 V dc to V_CC Low-level enable voltage (V_EL) 3/ ............................. 0 Vdc to 0.8 Vdc Operating temperature range (T_A) .............................. −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.