scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

PIN. The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device Type Generic number Circuit function 01 54ACT32 Quad two-input OR gate, TTL compatible inputs 02 54ACT11032 Quad two-input OR gate, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_CC).................................... −0.5 V dc to +6.0 V dc DC input voltage range (V_IN).................................. −0.5 V dc to V_CC + 0.5 V dc DC output voltage range (V_OUT)................................ −0.5 V dc to V_CC + 0.5 V dc DC input diode current........................................ ±20 mA DC output diode current (per pin)............................. ±50 mA DC output source or sink current.............................. ±50 mA DC V_CC or GND current......................................... ±50 mA 4/ Maximum power dissipation (P_D)................................ 500 mW Storage temperature range (T_STG).............................. −65°C to + 150°C Lead temperature (soldering, 10 seconds)...................... +300°C Thermal resistance, junction-to-case (Θ_JC).................... See MIL-STD-1835 Junction temperature (T_J)..................................... +175°C

Supply voltage range (V_CC)................................... 4.5 V dc to +5.5 V dc Minimum high level input voltage (V_IH)....................... 2.0 V dc Maximum low level input voltage (V_IL)........................ 0.8 V dc Input voltage range (V_IN).................................... +0.0 V dc to V_CC Output voltage range (V_OUT).................................. +0.0 V dc to V_CC Maximum input rise or fall rate (Δt/ΔV):..................... 0 to 8 ns/V Case operating temperature range (T_C)........................ −55°C to + 125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)................ XX percent 6/

intended Use: