DLA - SMD-5962-96696
MICROCIRCUIT, LINEAR, RADIATION HARDENED. CMOS FLASH 8-BIT A/D CONVERTER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 10 January 1996 |
| Status: | inactive |
| Page Count: | 14 |
scope:
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
The PIN shall be as shown in the following example:
Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 HS9008RH Radiation hardened CMOS flash 8-bit A/D converter
The device class designator shall be a single letter identifying the product assurance level as follows:
Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style X CDIP2-T28 28 Dual-in-line Y CDFP3-F28 28 Flat pack
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
DC supply voltage range, VDDD = VDDA (Referenced to VSSD = VSSA = GND) - - - −0.3 V dc to +7.0 V dc Input voltage range: [C bar][E bar][1 bar], CE2, CLK, VREF−, VREF+, VIN, ½ R - - - - - - - - VSS − 0.3 V dc to VDD + 0.3 V dc Output voltage range: B1 - B8, OF (Outputs off)- - - - - - - - - - - - - - - VSS − 0.3 V dc to VDD + 0.3 V dc DC input current [C bar][E bar][1 bar], CE2, CLK, VIN, B1 - B8, OF - - - - - - - - - - - - - - 10 mA Storage temperature range - - - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum package power dissipation at TA = +125°C (PD): 2/ Case outline X - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 1.02 W Case outline Y - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 0.77 W Thermal resistance, junction-to-case (ΘJC): Case outline X - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 9°C/W Case outline Y - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 10°C/W Thermal resistance, junction-to-ambient (ΘJA): Case outline X - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 49°C/W Case outline Y - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - 65°C/W Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - - - - - - - +300°C Junction temperature (TJ) - - - - - - - - - - - - - - - - - - - - - - - - - +175°C
Operating voltage range (VDDD = VDDA)- - - - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Digital input low voltage (VIL) - - - - - - - - - - - - - - - - - - - - - - 0 V to 0.2 VDD Input high voltage (VIH) - - - - - - - - - - - - - - - - - - - - - - - - - - 0.8 VDD to VDD Ambient operating temperature range (TA) - - - - - - - - - - - - - - - - - - −55°C to +125°C Radiation features: SEP effective let no upset 3/- - - - - - - - - - - - - - - - - - - - - - - >100 MeV/(cm2/mg) Neutron irradiation 3/ - - - - - - - - - - - - - - - - - - - - - - - - - - >1 × 1014 neutrons/cm2 Dose rate upset (20 ns pulse) 3/ - - - - - - - - - - - - - - - - - - - - - >5 × 108 RAD/sec Total dose - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - >300 K RAD (Si) Dose rate survivability 3/ - - - - - - - - - - - - - - - - - - - - - - - - >5 × 1011 RADS (Si)/sec
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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