scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54AC521 8-Bit magnitude comparator with enable 02 54AC11521 8-Bit magnitude comparator with enable

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - −0.5 V dc to +6.0 V dc DC input voltage range (V_IN) - - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc DC output voltage range (V_OUT) - - - - - - - - - - - - - - −0.5 V dc to V_CC + 0.5 V dc Clamp diode current (I_IK, I_OK) - - - - - - - - - - - - - - ±20 mA DC output current (I_OUT) - - - - - - - - - - - - - - - - - ±50 mA DC V_CC or GND current (I_CC, I_GND) - - - - - - - - - - - - ±100 mA 3/ Storage temperature range (T_STG) - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - - - - 500 mW Lead temperature (soldering, 10 seconds) - - - - - - - - - +300°C Thermal resistance, Junction-to-case (θ_JC) - - - - - - - - See MIL-M-38510, Appendix C Junction temperature (T_J) - - - - - - - - - - - - - - - - +175°C

Supply voltage range (V_CC) - - - - - - - - - - - - - - - - +3.0 V dc to +5.5 V dc Output voltage range - - - - - - - - - - - - - - - - - - - +0.0 V dc to V_CC Maximum low level input voltage (V_IL) - - - - - - - - - - 0.90 V at V_CC = 3.0 V 1.35 V at V_CC = 4.5 V 1.65 V at V_CC = 5.5 V Minimum high level input voltage (V_IH) - - - - - - - - - - 2.10 V at V_CC = 3.0 V 3.15 V at V_CC = 4.5 V 3.85 V at V_CC = 5.5 V Case operating temperature range (T_C) - - - - - - - - - - −55°C to +125°C Input rise and fall rate (t_r, t_f) maximum: V_CC = 3.6 V, V_CC = 5.5 V - - - - - - - - - - - - - - - - 8 ns/V

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - XX percent 5/

intended Use: