scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (−) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Input/output levels Chip enable Access time 01 32K × 8 CMOS SRAM CMOS Dual 60 ns 02 32K × 8 CMOS SRAM TTL Dual 60 ns 03 32K × 8 CMOS SRAM CMOS Dual 40 ns 04 32K × 8 CMOS SRAM TTL Dual 40 ns 05 32K × 8 CMOS SRAM CMOS Dual 60 ns 06 32K × 8 CMOS SRAM TTL Dual 60 ns 07 32K × 8 CMOS SRAM CMOS Dual 40 ns 08 32K × 8 CMOS SRAM TTL Dual 40 ns 09 32K × 8 CMOS SRAM CMOS Single 55 ns 10 32K × 8 CMOS SRAM TTL Single 55 ns 11 32K × 8 CMOS SRAM CMOS Dual 55 ns 12 32K × 8 CMOS SRAM TTL Dual 55 ns 13 32K × 8 CMOS SRAM CMOS Dual 30 ns 14 32K × 8 CMOS SRAM TTL Dual 30 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outlines shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 36 Flat pack Y See figure 1 40 Flat pack Z See figure 1 36 Flat pack U See figure 1 36 Flat pack T See figure 1 36 Flat pack M GDIP1-T28 or CDIP2-T28 28 Dual-in-line N See figure 1 36 Flat pack 9 See figure 1 28 Flat pack

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (V_CC) -------------------------------------- −0.5 V dc to +7.0 V dc DC input voltage range (V_IN) ------------------------------------ −0.5 V dc to V_CC + 0.3 V dc DC output voltage range V_OUT) ----------------------------------- −0.5 V dc to V_CC + 0.3 V dc Storage temperature range --------------------------------------- −65°C to +150°C Lead temperature (soldering, 5 seconds) ------------------------- +250°C Thermal resistance, junction-to-case (Θ_JC): Cases X and Y ------------------------------------------------- 3.3°C/watt Cases Z and U ------------------------------------------------- 2.2°C/watt. Case T -------------------------------------------------------- 10°C/watt Case M -------------------------------------------------------- See MIL-STD-1835 Case N -------------------------------------------------------- 2.1°C/watt Output voltage applied to high Z state -------------------------- −0.3 V dc to V_CC + 0.3 V dc Maximum power dissipation (P_D) ---------------------------------- 2 watts Maximum junction temperature (T_J) ------------------------------- +150°C 4/

Supply voltage range (V_CC) --------------------------------------- 4.5 V dc (min) to 5.5 V dc (max) Supply voltage (V_SS) --------------------------------------------- 0.0 V dc High level input voltage range (V_IH): Device types 01,03,09,11,13 (CMOS levels) ---------------------- 3.5 V dc to V_CC + 0.3 V dc Device types 05,07 (CMOS levels) ------------------------------- 0.7 × V_CC to V_CC + 0.3 V dc Device types 02,04,06,08,10,12,14 (TTL levels) ----------------- 2.2 V dc to V_CC + 0.3 V dc Low level input voltage range (V_IL): Device types 01,03,09,11,13 (CMOS levels) ---------------------- −0.3 V dc to 1.5 V dc Device types 05,07 (CMOS levels) ------------------------------- −0.3 V dc to 0.3 × V_CC Device types 02,04,06,08,10,12,14 (TTL levels) ----------------- −0.3 V dc to 0.8 V dc Case operating temperature range (T_C) ---------------------------- −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ------------------- 100 percent

intended Use: