scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number 1/ Circuit function Data retention Access time 01 256K × 16 CMOS SRAM No 35 ns 02 256K × 16 CMOS SRAM No 25 ns 03 256K × 16 CMOS SRAM No 20 ns 04 256K × 16 CMOS SRAM Yes 35 ns 05 256K × 16 CMOS SRAM Yes 25 ns 06 256K × 16 CMOS SRAM Yes 20 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level 8 microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X See figure 1 44 flat package Y See figure 1 44 CSOJ package

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Voltage on any input relative to V_SS - - - - - - - - - −0.5 V dc to +7.0 V dc Storage temperature range - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) - - - - - - - - - - - - 1.5 W Lead temperature (soldering, 10 seconds) - - - - - - - +260°C Thermal resistance, junction-to-case (Θ_JC): Case X - - - - - - - - - - - - - - - - - - - - - - - EDI to provide Case Y - - - - - - - - - - - - - - - - - - - - - - - EDI to provide Junction temperature (T_J) - - - - - - - - - - - - - - - +150°C 3/ Output current - - - - - - - - - - - - - - - - - - - - 20 mA

Supply voltage range (V_CC) - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Supply voltage (V_SS) - - - - - - - - - - - - - - - - 0 V Input high voltage range(V_IH) - - - - - - - - - - - - 2.2 V dc to V_CC + 0.5 V dc Input low voltage range (V_IL) - - - - - - - - - - - - −0.3 V dc to +0.8 V dc 4/ Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . 5/ percent

intended Use: