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NPFC - MIL-STD-1310

SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR

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Organization: NPFC
Publication Date: 18 August 1987
Status: inactive
Page Count: 50
scope:

This standard provides methods for shipboard bonding, grounding, shielding, and the use of nonmetallic materials for the purpose of electromagnetic interference (EMI) reduction, intermodulation interference (IMI) reduction, protection of personnel from electrical shock, and protection of electronic equipment from an electromagnetic pulse (EEIP). In addition, methods for the installation of shipboard ground systems are also provided.

intended Use:

This standard specifies requirements for EMI reduction, EMP protection, personnel safety grounding, and The installation of cable ground systems for shipboard applications.

Document History

August 12, 2014
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY
A description is not available for this item.
September 17, 2009
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY
This document specifies standard practices to facilitate achievement of the intra-ship and intership electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation...
June 28, 1996
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This document specifies the performance requirements for shipboard bonding, grounding and shielding; identifies requirements for EMI control in the areas of hull-generated and equipment-generated...
December 30, 1992
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This document provides methods for shipboard bonding, grounding, shielding, and the use of nonmetallic materials for electromagnetic interference (EMI) reduction, intermodulation interference (IMI)...
MIL-STD-1310
August 18, 1987
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard provides methods for shipboard bonding, grounding, shielding, and the use of nonmetallic materials for the purpose of electromagnetic interference (EMI) reduction, intermodulation...
February 8, 1979
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard covers those elements of ship design requirements essential to th:*att%%t of shipboard electromagnetic compatibility (EMC) by effecting suppression of potential sources of...
November 30, 1973
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard sets forth methods for shipboard bonding, grounding, and the utilization of non-metallic materials for the purpose of electromagnetic interference (EMI) reduction and the protection of...
April 15, 1971
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard provides shipboard bonding, grounding and other techniques for electromagnetic compatibility and safety
December 27, 1967
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
A description is not available for this item.
April 21, 1967
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard outlines shipboard construction and equipment installation requirements and the practices necessary to minimize the electromagnetic interference (EMI) environment aboard Naval Ships,...

References

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