NPFC - MIL-STD-1310
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
| Organization: | NPFC |
| Publication Date: | 28 June 1996 |
| Status: | inactive |
| Page Count: | 43 |
scope:
This document specifies the performance requirements for shipboard bonding, grounding and shielding; identifies requirements for EMI control in the areas of hull-generated and equipment-generated EMI, hull and cable penetration EMI, and superstructure blockage/reflections
The requirements specified herein apply to metal and non-metallic hull ships and are applicable during ship construction and ship overhaul, alteration or repair availabilities. Requirements herein may be invoked upon contractor and government (military and civilian) personnel.
The requirements herein may be subject to deletion tailoring, such that only those items that pertain to a specific ship are specified in the solicitation or contract. Due to cost impact:
a. The shielding provisions for electromagnetic pulse (EMP) protection herein are to be implemented only when specified, and
b. Replacement of bond straps with later approved versions is not recommended or required, unless inspection or testing indicates a need for such action.
All shipboard class B and class C bonding involves either bolting equipment or bolting a bond strap in place to attain a min3-mum resistance (0.1 ohm), low RF impedance (less than 25 ohms at 30 MHz) electrical bond. This appendix provides suggested methods for surface preparation,material
intended Use:
This standard specifies EMI/IMI reduction techniques, EMP protection measures, personnel safety grounding requirements and methods for installing shipboard cable ground systems.
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