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NPFC - MIL-STD-1310

SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR

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Organization: NPFC
Publication Date: 28 June 1996
Status: inactive
Page Count: 43
scope:

This document specifies the performance requirements for shipboard bonding, grounding and shielding; identifies requirements for EMI control in the areas of hull-generated and equipment-generated EMI, hull and cable penetration EMI, and superstructure blockage/reflections; specifies requirements for protection of personnel from electrical shock, and identifies the applicable requirements for measuring the effectiveness of EMI control and safety measures implemented when requirements herein are invoked.

The requirements specified herein apply to metal and non-metallic hull ships and are applicable during ship construction and ship overhaul, alteration or repair availabilities. Requirements herein may be invoked upon contractor and government (military and civilian) personnel.

The requirements herein may be subject to deletion tailoring, such that only those items that pertain to a specific ship are specified in the solicitation or contract. Due to cost impact:

a. The shielding provisions for electromagnetic pulse (EMP) protection herein are to be implemented only when specified, and

b. Replacement of bond straps with later approved versions is not recommended or required, unless inspection or testing indicates a need for such action.

All shipboard class B and class C bonding involves either bolting equipment or bolting a bond strap in place to attain a min3-mum resistance (0.1 ohm), low RF impedance (less than 25 ohms at 30 MHz) electrical bond. This appendix provides suggested methods for surface preparation,material selection, installation techniques, and sealing and preservation applicable to this objective. Compliance with this Appendix is optional, but the requirement to ensure EMC and safety through effective and sustainable bonding and grounding (where applicable) is mandatory. The information contained herein is provided as effective solutions to troublesome bonding, grounding, and corrosion control problems identified as a result of extensive military ship maintenance experience. Unless alternative solutions are available as a result of advancing technology or improved materials, implementation of the procedures herein is invited.

intended Use:

This standard specifies EMI/IMI reduction techniques, EMP protection measures, personnel safety grounding requirements and methods for installing shipboard cable ground systems.

Document History

August 12, 2014
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY
A description is not available for this item.
September 17, 2009
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY, ELECTROMAGNETIC PULSE (EMP) MITIGATION, AND SAFETY
This document specifies standard practices to facilitate achievement of the intra-ship and intership electromagnetic compatibility (EMC), electromagnetic pulse (EMP), bonding, and intermodulation...
MIL-STD-1310
June 28, 1996
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This document specifies the performance requirements for shipboard bonding, grounding and shielding; identifies requirements for EMI control in the areas of hull-generated and equipment-generated...
December 30, 1992
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This document provides methods for shipboard bonding, grounding, shielding, and the use of nonmetallic materials for electromagnetic interference (EMI) reduction, intermodulation interference (IMI)...
August 18, 1987
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard provides methods for shipboard bonding, grounding, shielding, and the use of nonmetallic materials for the purpose of electromagnetic interference (EMI) reduction, intermodulation...
February 8, 1979
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard covers those elements of ship design requirements essential to th:*att%%t of shipboard electromagnetic compatibility (EMC) by effecting suppression of potential sources of...
November 30, 1973
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard sets forth methods for shipboard bonding, grounding, and the utilization of non-metallic materials for the purpose of electromagnetic interference (EMI) reduction and the protection of...
April 15, 1971
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard provides shipboard bonding, grounding and other techniques for electromagnetic compatibility and safety
December 27, 1967
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
A description is not available for this item.
April 21, 1967
SHIPBOARD BONDING, GROUNDING, AND OTHER TECHNIQUES FOR ELECTROMAGNETIC COMPATIBILITY AND SAFETY, STANDARD PRACTICE FOR
This standard outlines shipboard construction and equipment installation requirements and the practices necessary to minimize the electromagnetic interference (EMI) environment aboard Naval Ships,...

References

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