scope:

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

The complete PIN is as shown in the following example:

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function Output 01 TSC429 Inverting power MOSFET driver 4.5 A dc 02 TSC4429 Inverting power MOSFET driver 4.5 A dc 03 TSC4420 Noninverting power MOSFET driver 4.5 A dc 04 MIC4451 Inverting hi speed, hi current MOSFET driver 12 A dc 05 MIC4452 Noninverting hi speed, hi current MOSFET driver 12 A dc 06 MIC44R21 Inverting, rad hardened MOSFET driver 9 A dc 07 MIC44R22 Noninverting, rad hardened MOSFET driver 9 A dc

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style H GDFP1-F10 or CDFP2-F10 10 Flat pack P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier

The lead finish is as specified in MIL-PRF-38535, appendix A.

Supply voltage (V_S)........................................... 20 V dc Input voltage range (V_IN): Device 01 .................................................. V_S + 0.3 V dc to GND − 0.3 V dc Devices 02, 03, 04, 05 ..................................... V_S + 0.3 V dc to GND − 5.0 V dc Output current (per pin, capacitance load): Devices 01 - 03............................................. 6.0 A dc Devices 04 - 05............................................. 12.0 A dc Devices 06 - 07 ............................................ 9.0 A dc Peak supply current or GND current (per pin): Devices 01 - 03............................................. 6.0 A dc Devices 04 - 05............................................. 12.0 A dc Devices 06 - 07 ............................................ 9.0 A dc Storage temperature range..................................... −55°C to + 125°C Power dissipation (P_D): Case outline H........................................ 650 mW1/ Case outline P........................................ 800 mW2/ Case outline 2........................................ 1.8 W 3/ Lead temperature (soldering, 10 seconds)................ +300°C Junction temperature range (T_J)......................... −55°C to +150°C

Supply voltage range..................................... 4.5 V dc ≤ V_S ≤ 18 V dc Ambient operating temperature range (T_A)................. −55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.