scope:

This drawing forms a part of a one part - one number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices", When available, a choice of radiation hardness (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-39510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non RHA device.

Device type Generic number 1/ Circuit function Access time 01 256K × dynamic random access memory 150 ns 02 256K × dynamic random access memory 120 ns 03 256K × dynamic random access memory 100 ns 04 256K × dynamic random access memory 80 ns 05 256K × dynamic random access memory 70 ns

The device class designator shall be a single letter identifying the product assurance level (see 6.7 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall be a single meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line X See figure 1 20 J-leaded small-outline Y See figure 1 20 Rectangular chip carrier Z See figure 1 20 Thin rectangular chip carrier U See figure 1 20 Flat pack T See figure 1 20 Zig-zag-in-line N See figure 1 20 Flat pack

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range on any pin . . . . . . . . −1.0 V dc to 7.0 V dc Input voltage range on V_CC . . . . . . . . . . 0 V dc to 7.0 V dc Short circuit output current . . . . . . . . . 50 mA Maximum power dissipation (P_D). . . . . . . . . 1 W Storage temperature range . . . . . . . . . . . −65°C to +150°C Lead temperature (soldering, 10 seconds). . . . +260°C Thermal resistance, junction-to-case (θ_JC): Case R . . . . . . . . . . . . . . . . . . See MIL-STD-1835 Case X . . . . . . . . . . . . . . . . . . 20°C/W Case Y . . . . . . . . . . . . . . . . . . 20°C/W Case Z . . . . . . . . . . . . . . . . . . 20°C/W Case U . . . . . . . . . . . . . . . . . . 20°C/W Case T . . . . . . . . . . . . . . . . . . 7.0°C/W Case N . . . . . . . . . . . . . . . . . . 20°C/W Junction temperature (T_J) 3/. . . . . . . . . +175°C

Supply voltage range (V_CC) 4/. . . . . . . . +4.5 V dc to +5.5 V dc High level input voltage range (V_IH) . . . . 2.4 V dc minimum to 6.5 V dc maximum Low level input voltage range (V_IL) 5/ . . . . −1.0 V dc minimum to 0.8 V dc maximum Case operating temperature range (T_C) . . . . −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) . . . . . . . . xx percent 6/

intended Use: