scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes B, Q and M), and space application (device classes S and V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device classes M, B, and S RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The identify the circuit function as follows:

Device type Generic number Circuit function 01 54ACT74 DUAL D-type flip-flop with preset and clear, TTL compatible inputs 02 54ACT11074 DUAL D-type flip-flop with preset and clear, TTL compatible inputs

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A B or S Certification and qualification to MIL-PRF 38535, appendix A Q or V Certification and qualification to MIL-PRF 38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat 2 CQCC1-N20 or CQCC2-N20 20 Leadless-chip-carrier

The lead finish is as specified in MIL-PRF-38535 for device classes Q, and V or MIL-PRF-38535, appendix A for device classes M, B, and S.

Supply voltage range (V_CC).......................................−0.5 V dc to +6.0 V dc DC input voltage range (V_IN).....................................−0.5 V dc to V_CC + 0.5 V dc DC output voltage range (V_OUT)...................................−0.5 V dc to V_CC + 0.5 V dc Clamp diode current (I_IK, I_OK)...................................±20 mA DC output current (I_OUT).........................................±50 mA DC V_CC or GND current (I_CC, I_GND)................................±100 mA 3/ Storage temperature range (T_STG).................................−65°C to +150°C Maximum power dissipation (P_D)...................................500 mW Lead temperature (soldering, 10 seconds).........................+300°C Thermal resistance, junction-to-case (θ_JC).......................See MIL-M-1835 Junction temperature (T_J)........................................+175°C Case operating temperature (T_C)..................................−55°C to +125°C

Supply voltage range (V_CC).......................................+4.5 V dc to +5..5 V dc Input voltage range (V_IN)........................................+0.0 V dc to V_CC Output voltage range (V_OUT)......................................+0.0 V dc to V_CC Maximum low level input voltage (V_IL)............................0.8 V dc at V_CC = 4.5 V dc 0.8 V dc at V_CC = 5.5 V dc Minimum high level input voltage (V_IH)...........................2.0 V dc at V_CC = 4.5 V dc 2.0 V dc at V_CC = 5.5 V dc Case operating temperature range (T_C)............................−55°C to +125°C Input rise and fall rate (t_r, t_f) maximum: V_CC = 4.5 V....................................................10 ns/V V_CC = 5.5 V....................................................8 ns/V Maximum high level output current (I_OH)..........................−24 mA Maximum low level output current (I_OL)...........................24 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012)............. XX percent 5/

intended Use: