scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number 1/ Circuit function Access time 01 1 M × 4, DYNAMIC RAM 120 ns 02 1 M × 4, DYNAMIC RAM 100 ns 03 1 M × 4, DYNAMIC RAM 80 ns

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 dual-in-line X See figure 1 20 flat pack Y See figure 1 26/20 leadless ceramic chip carrier Z See figure 1 26/20 J-leaded chip carrier U See figure 1 20 dual-in-line T See figure 1 26/20 leadless ceramic chip carrier M See figure 1 20 flat pack N See figure 1 20 zig-zag in-line

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Voltage range on any pin - - - - - - - - - - - - - - −1 V dc to 7 V dc Voltage range on V_CC - - - - - - - - - - - - - - - - −1 V dc to 7 V dc Short circuit output current - - - - - - - - - - - - 50 mA Maximum power dissipation (P_D) - - - - - - - - - - - 1 W Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) Case outline R - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Case outlines X, Y, Z, U, T, M, and N - - - - - - 20°C/W 3/ Junction temperature (T_J) 4/ - - - - - - - - - - - - +175°C

Supply voltage range (V_CC) 5/ - - - - - - - - - - - 4.5 V dc to +5.5 V dc High-level input voltage (V_IN) - - - - - - - - - - - 2.4 V dc minimum to 6.5 V dc maximum Low-level input voltage (V_IL) 6/ - - - - - - - - - - −1.0 V dc minimum to 0.8 V dc maximum Case operating temperature range (T_C) - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012)- - - - 7/ percent

intended Use: