scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). This drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. Two product assurance classes, military high reliability (device class H) and space application (device class K) and a choice of case outline and lead finishes are available and available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes H and K RHA marked devices shall meet the MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Accuracy 01 SDC14531-690 11.8 V, 400 Hz, S-R/D Converter ±1.3 arc minutes 02 SDC14531-631 11.8 V, 400 Hz, S-R/D Converter ±1.3 arc minutes

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirement documentation H or K Certification and qualification to MIL-H-38534

The case outlines(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline X See figure 1 (36-lead, 1.90" × .780" × .210"), dual-in-line package

The lead finish shall be as specified in MIL-H-38534 for classes H and K. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_S) - - - - - - - - - - - - - - - - - +7.0 V dc Reference input - - - - - - - - - - - - - - - - - - - 150 V rms Digital inputs - - - - - - - - - - - - - - - - - - - −0.3 V dc to +7.0 V dc Power dissipation (P_D) - - - - - - - - - - - - - - - 210 mW 1/ Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 sec) - - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - 8.0°C/W Thermal resistance, junction-to-ambient (θ_JA) - - - - 20°C/W Junction temperature (T_J) - - - - - - - - - - - - - - +150°C

Supply voltage (V_S) - - - - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Case operating temperature range (T_C) - - - - - - - - 55°C to +125°C

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.