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IEC 60749-42

Semiconductor devices – Mechanical and climatic test methods – Part 42: Temperature and humidity storage

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Organization: IEC
Publication Date: 1 August 2014
Status: active
Page Count: 20
ICS Code (Semiconductor devices in general): 31.080.01
scope:

This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments.

This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration through the passivation film and as a pre-conditioning for various kinds of tests.

Document History

IEC 60749-42
August 1, 2014
Semiconductor devices – Mechanical and climatic test methods – Part 42: Temperature and humidity storage
This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the...

References

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