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IPC-A-610 GERMAN

Acceptability for Electronic Assemblies

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Organization: IPC
Publication Date: 1 July 2014
Status: inactive
Page Count: 439

Document History

IPC-A-610 GERMAN
October 1, 2017
Acceptability of Electronic Assemblies
A description is not available for this item.
IPC-A-610 GERMAN
July 1, 2014
Acceptability for Electronic Assemblies
A description is not available for this item.
IPC-A-610 GERMAN
April 1, 2010
Acceptability for Electronic Assemblies
Diese Richtlinie ist eine Zusammenstellung von Abnahmekriterien für die visuelle Inspektion elektronischer Baugruppen. Dieses Dokument präsentiert Abnahmeanforderungen für die Herstellung...
IPC-A-610 GERMAN
February 1, 2005
Acceptability of Electronic Assemblies
Dieser Standard ist eine Zusammenstellung von Abnahmekriterien für die visuelle Inspektion elektronischer Baugruppen. Dieses Dokument präsentiert Abnahmeanforderungen für die Herstellung elektrischer...
IPC-A-610 GERMAN
January 1, 2000
Acceptability of Electronic Assemblies
A description is not available for this item.

References

This document references:
ESD S20.20 - the Development of an Electrostatic Discharge Control Program for - Protection of Electrical and Electronic Parts, Assemblies, and Equipment (Excluding Electrically Initiated Explosive Devices)
Published by ESD on June 11, 2014
This document applies to activities that manufacture, process, assemble, install, package, label, service, test, inspect, transport or otherwise handle electrical or electronic parts, assemblies and...
This document references:
J-STD-003 - Solderability Tests for Printed Boards
Published by IPC on April 1, 2014
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
IPC-DW-425 - Design and End Product Requirements for Discrete Wiring Boards
Published by IPC on May 1, 1990
This standard covers design and end product requirements of discrete wiring boards which utilize discrete wires to interconnect termination areas on or within flexible or rigid materials that may...
This document references:
IPC/ECA J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Published by IPC on January 1, 1992
A description is not available for this item.
This document references:
IPC-SM-840 - Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
Published by IPC on December 1, 2010
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask material under evaluation with the minimum of test...
This document is referenced by:
DIN EN 61191-3 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Published by DIN on May 1, 2018
Dieser Teil von IEC 61191 legt die Anforderungen an die Lötmontage von Baugruppen in Durchstecktechnik fest. Die Anforderungen beziehen sich auf Baugruppen, die ausschließlich in...
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