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QUALIFIED PRODUCT LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-PRF-31032 Printed Circuit Board/Printed Wiring Board, General Specification for This list has been prepared for use by or for the Government in the acquisition of products covered by the subject...
Purpose: This issuance: • Establishes policy and assigns responsibilities for a DoD Executive Agent (EA) for Printed Circuit Board (PrCB) and Interconnect Technology and designates the Secretary of the Navy as the DoD EA for PrCB and Interconnect Technology, in accordance with Section...
The connector covered by this specification sheet is intended for use on control and instrument panels for aircraft, ground, and shipboard applications.
This specification covers a terpene base solvent cleaner in the form of a liquid, which forms a transient emulsion with water.
This document addresses the quality of measured S-parameters for electrical printed circuit board (PCB) and related interconnect at frequencies up to 50 GHz. This might include, but is not limited to: test fixtures, as well as methods and processes for controlling the accuracy and...
QUALIFIED PRODUCT LIST OF PRODUCTS QUALIFIED UNDER PERFORMANCE SPECIFICATION MIL-DTL-32385 Connector, Receptacles, Plugs, Adapter, Used on Electroluminescent, Embedded, and Printed Circuit Board Lamp Lighting Panels General Specification for This list has been prepared for use by or...
Purpose. The purpose of the relay is to switch and carry load currents while a minor control current through the relay coil is applied. The relay must provide only two (2) operating modes: • Switching Contact Open: No current flows • Switching Contact Closed: Load current flows An intermediate...
This specification establishes the general performance requirements for printed circuit boards or printed wiring boards (hereafter designated printed board) and the verification requirements for insuring that these items meet the applicable performance requirements. Certification and...
This drawing outlines the general requirements for families of high density/high performance two piece electrical connectors, intended for printed circuit board attachment and connection, utilizing through hole (solder and compliant pin), surface mount, or wire harness termination...
This part of IEC 61188 describes the configuration of part shape data of semiconductor devices and electrical components registered in the CAD library. This document mainly describes the configuration of 2D and 3D parts shape data.
IEC 61188-6-1:2021 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint...
This part of IEC 61188 specifies the requirements for soldering surfaces on circuit boards. This includes lands and land pattern for surface mounted components and also solderable hole configurations for through-hole mounted components. These requirements are based on the solder joint...
IEC 61188-6-2:2021 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191‑2:2017.
This part of IEC 61188 describes the requirements of design and use for soldering surfaces of land pattern on circuit boards. This document includes land pattern for surface mounted components. These requirements are based on the solder joint requirements of IEC 61191-2:2017.
