Mechanical Drawing - Standards Search

CEI EN IEC 62610-6 - Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 6: Air recirculation and bypass of indoor cabinets

November 1, 2020 - CEI

This part of IEC 62610 which deals with thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series, provides compatible measurement methods of recirculation ratio and bypass ratio which are indicators for defining quality of airflow in the forced air cooling that can be...

CEI EN IEC 60191-1 - Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices

July 1, 2018 - CEI

This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. For the preparation of outline drawings of surface-mounted discrete devices with a lead count...

IEC 62610-6 - Mechanical structures for electrical and electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Part 6: Air recirculation and bypass of indoor cabinets

March 1, 2020 - IEC

This part of IEC 62610 which deals with thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series, provides compatible measurement methods of recirculation ratio and bypass ratio which are indicators for defining quality of airflow in the forced air cooling that can be...

IEC 60191-1 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

January 1, 2018 - IEC

This part of IEC 60191 gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. For the preparation of outline drawings of surface-mounted discrete devices with a lead count...

DS/EN IEC 60191-1 - Mechanical standardization of semiconductor devices – Part 1: General rules for the preparation of outline drawings of discrete devices

April 4, 2018 - DS

IEC 60191-1:2018(E) gives guidelines on the preparation of outline drawings of discrete devices, including discrete surface-mounted semiconductor devices with lead count less than 8. This edition includes the following significant technical changes with respect to...

BS EN IEC 60191-1 - Mechanical standardization of semiconductor devices Part 1: General rules for the preparation of outline drawings of discrete devices

April 30, 2018 - BSI

A description is not available for this item.

CEI EN IEC 62610-2 - Mechanical structures for electrical and electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series Part 2: Method for the determination of forced air cooling

January 1, 2019 - CEI

This part of IEC 62610 provides for compatible methods of configuring forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with the IEC 60297 and IEC 60917 series. This document contains the following: a) thermal interfaces of subracks and/or chassis-based...

DS/EN IEC 62610-2 - Mechanical structures for electrical and electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Part 2: Method for the determination of forced air cooling

July 17, 2018 - DS

IEC 62610-2:2018 provides for compatible methods of configuring forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with the IEC 60297 and IEC 60917 series. This document contains the following: a) thermal interfaces of subracks and/or chassis-based equipment...

IEC 62610-2 - Mechanical structures for electrical and electronic equipment – Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series – Part 2: Method for the determination of forced air cooling

May 1, 2018 - IEC

This part of IEC 62610 provides for compatible methods of configuring forced air cooled cabinets assembled with associated subracks and/or chassis in accordance with the IEC 60297 and IEC 60917 series. This document contains the following: a) thermal interfaces of subracks and/or chassis-based...

ASTM F3290-17 - Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure

November 1, 2017 - ASTM International

1.1 This guide covers proper handling and application of a flexible circuit membrane switch, or printed electronic assembly to its final support structure to avoid mechanical or electrical failure. 1.2 Damage of internal tactile devices or surface mount device (SMD) components can occur with...

CEI EN 60191-6-13 - Mechanical standardization of semiconductor devices Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

May 1, 2017 - CEI

This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in...

DS/EN 60191-6-13 - Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

November 29, 2016 - DS

IEC 60191-6-13:2016 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in...

IEC 60191-6-13 - Mechanical standardization of semiconductor devices – Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

September 1, 2016 - IEC

This part of IEC 60191 specifies a design guideline of open-top-type semiconductor sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA). In particular, this part of IEC 60191 establishes the outline drawings and dimensions of the open-top-type test and burn-in...

CEI EN 60191-6-22 - Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

February 1, 2014 - CEI

This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

DS/EN 60191-6-22 - Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

April 9, 2013 - DS

IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

IEC 60191-6-22 - Mechanical standardization of semiconductor devices – Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

December 1, 2012 - IEC

This part of IEC 60191 provides the outline drawings and dimensions common to siliconbased package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).

CEI EN 60191-6-12 - Mechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

June 1, 2012 - CEI

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.

BS EN 60191-6-22 - Mechanical standardization of semiconductor devices Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

April 30, 2013 - BSI

A description is not available for this item.

DS/EN 60191-1 - Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

July 2, 2007 - DS

This part of 60191 gives guidelines on the preparation of outline drawings of discrete devices. NOTE: For preparation of outline drawings of surface mounted discrete devices, IEC 60191-6 should be referred to as well. The primary object of these drawings is to indicate the...

IEC 60191-6-12 - Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)

June 1, 2011 - IEC

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less.

Mechanical Drawing Standards