Surface Mounted Standards

Description This specification defines the qualification program for surface mount inductors. The qualification program is defined in Table 1. Specification sheets can be added, as required, to define specific products or to cover unique/specific requirements. This document does not...

This drawing describes the requirements for a bulk metal, ultra precision, surface mounted, fixed, film, chip resistor, style 1506.

This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling...

This drawing describes the requirements for a 16-pin, surface mount resistor network.

This drawing describes the requirements for a variable, surface mount, nonwirewound (adjustment type, lead screw actuated) resistor.

Scope and object This Standard describes the transportation and storage conditions for surface mounting devices (hereafter referred to as "SMDs") that are fulfilled and used in order to enable trouble-free processing of surface mounting devices, both active and passive....

This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine's placement capability and conformance to the specification while maintaining placement...

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not...

This International Standard defines requirements for component specificiations of electronic components that are intended for usage in surface mount technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling...

This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not...

This Standard gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology.

This drawing describes the requirements for a miniature quartz crystal unit, surface mount, with a frequency range of 10 to 2,100 kilohertz, supplied to the requirements of this drawing specified herein.

IEC 61760-1:2020 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology. To this end, it specifies a reference set of process conditions and related test conditions to be considered when compiling component...

This document covers requirements and test methods for dielectric adhesives used to hold components in place from mounting to the soldering process and for their long term properties as a part of the printed wiring board. Purpose This standard defines dielectric surface...

This document provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient...