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IPC-7530

Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)

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Organization: IPC
Publication Date: 1 March 2017
Status: active
Page Count: 52
scope:

This standard describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow and wave soldering.

Thermal profile is a unique temperature vs. time plot for each fully populated printed wiring board assembly (PWBA), using thermocouples attached with high-temperature solder or copper or aluminum tapes to selected representative components of the PWBA as it travels at a given belt speed (i.e., transport speed) through various temperature zones of an oven or soldering system.

Purpose The purpose of this standard is to provide useful and practical information for developing thermal profiles to produce acceptable SnPb and Pb-free electronics assemblies. This standard is for managers, design and process engineers and technicians who deal with mass soldering processes.

Document History

IPC-7530
March 1, 2017
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
This standard describes thermal profile guidelines and practical guidelines to meet requirements to produce acceptable solder joints in mass soldering processes, including but not limited to reflow...
May 1, 2001
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
This guideline document addresses the issues pertinent to temperature profiling of electronic assemblies for mass soldering processes (reflow and wave).  

References

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