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NPFC - MIL-PRF-55681

CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR

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Organization: NPFC
Publication Date: 8 September 2017
Status: active
Page Count: 44
scope:

This specification covers the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors. ER capacitors covered by this specification have failure rate levels (FRL) ranging from 1.0 percent to 0.001 percent per 1,000 hours. These FRLs are established at a 90-percent confidence level and maintained at a 10 percent producer's risk and are based on life tests performed at maximum rated voltage at maximum rated temperature. An acceleration factor of 8:1 has been used to relate life test data obtained at 200 percent of rated voltage at maximum rated temperature, to rated voltage at rated temperature.

intended Use:

Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in... View More

Document History

MIL-PRF-55681
September 8, 2017
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in capacitance...
MIL-PRF-55681
July 12, 2016
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in capacitance...
MIL-PRF-55681
July 12, 2016
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-PRF-55681
September 3, 2004
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
Ceramic chip capacitors are intended to be used in thin and thick film hybrid circuits where micro-circuitry is indicated for filter by-pass coupling applications, and where variation in capacitance...
MIL-PRF-55681
September 3, 2004
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-PRF-55681
July 10, 2001
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-PRF-55681
June 29, 1998
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-PRF-55681E
July 3, 1997
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers the general requirements for non-established reliability (non-ER) and established reliability (ER), ceramic dielectric, multiple layer, chip capacitors. ER capacitors...
MIL-PRF-55681
July 3, 1997
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
July 13, 1994
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
July 13, 1994
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers established reliability, ceramic dielectric, multiple layer, chip capacitors. Capacitors covered by this specification have failure rate levels ranging from 1.0 to 0.001...
MIL-C-55681
June 21, 1993
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
June 29, 1992
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
June 14, 1990
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
This specification covers established reliability, ceramic dielectric, multiple layer, chip capacitors. Capacitors covered by this specification have failure rate levels ranging from 1.0 to 0.001...
MIL-C-55681
June 14, 1990
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
October 7, 1985
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
April 5, 1985
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
August 25, 1983
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
November 22, 1982
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
July 30, 1981
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
July 30, 1981
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681B (1)
April 1, 1977
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
June 17, 1976
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681B SUPP 1
June 17, 1976
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
MIL-C-55681
June 20, 1975
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
A description is not available for this item.
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References

This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
JESD557D - Statistical Process Control Systems
Published by JEDEC on May 1, 2023
This standard specifies the general requirements of a statistical process control (SPC) system.
This document references:
MIL-STD-202-103 - TEST METHOD STANDARD METHOD 103, HUMIDITY (STEADY STATE)
Published by NPFC on April 18, 2015
Purpose. This test is performed to evaluate the properties of materials used in components as they are influenced by the absorption and diffusion of moisture and moisture vapor. This is an...
This document is referenced by:
DSCC-DWG-05001 - CAPACITOR, FIXED, CERAMIC, CHIP, 0805, HIGH FREQUENCY, BP
Published by DOD on February 1, 2018
This drawing and MIL-PRF-55681 describe the requirements for ceramic, chip.
This document is referenced by:
DSCC-DWG-05002 REV J - CAPACITOR, FIXED, CERAMIC, CHIP, 0603, HIGH FREQUENCY, BP
Published by DLA on September 27, 2022
Scope. This drawing and MIL-PRF-55681 describe the requirements for ceramic, chip.
This document is referenced by:
DSCC-DWG-05003 - CAPACITOR, FIXED, CERAMIC, CHIP, 0402, HIGH FREQUENCY, BP
Published by DOD on February 1, 2018
This drawing and MIL-PRF-55681 describe the requirements for ceramic, chip.
This document is referenced by:
DSCC-DWG-03029 - CAPACITOR, FIXED, CERAMIC, CHIP, 0402
Published by DOD on July 3, 2019
Scope. This drawing and MIL-PRF-55681 describe the requirements for ceramic, chip.
This document is referenced by:
DSCC-DWG-03028 REV G - CAPACITOR, FIXED, CERAMIC, CHIP, 0603
Published by DLA on November 9, 2021
Scope. This drawing and MIL-PRF-55681 describe the requirements for ceramic, chip.
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