IPC - TM-650 2.6.3.1E
Solder Mask - Moisture and Insulation Resistance
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 March 2007 |
| Status: | active |
| Page Count: | 5 |
scope:
This test method is used to determine the moisture and insulation resistances of applied polymer solder mask under two separate prescribed conditions of temperature and humidity. One condition is described as Class T and the other Class H. Raw material qualification testing is performed on designated comb patterns. Production quality conformance testing is performed on a standard ''Y'' pattern.
Document History
TM-650 2.6.3.1E
March 1, 2007
Solder Mask - Moisture and Insulation Resistance
This test method is used to determine the moisture and insulation resistances of applied polymer solder mask under two separate prescribed conditions of temperature and humidity. One condition is...
July 1, 2000
Moisture and Insulation Resistance - Solder Mask
A description is not available for this item.
November 1, 1998
Moisture and Insulation Resistance - Polymeric Solder Masks and Conformal Coatings
A description is not available for this item.
February 1, 1988
Moisture and Insulation Resistance - Polymeric Solder Masks and Conformal Coatings
A description is not available for this item.