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IEC 63011-1

Integrated circuits – Three dimensional integrated circuits – Part 1: Terminology

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Organization: IEC
Publication Date: 1 November 2018
Status: active
Page Count: 28
ICS Code (Integrated circuits. Microelectronics): 31.200
scope:

This part of IEC 63011 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Document History

IEC 63011-1
November 1, 2018
Integrated circuits – Three dimensional integrated circuits – Part 1: Terminology
This part of IEC 63011 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to...

References

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