Integrated circuits – Three dimensional integrated circuits – Part 1: Terminology
|Publication Date:||1 November 2018|
|ICS Code (Integrated circuits. Microelectronics):||31.200|
This part of IEC 63011 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.