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JEDEC JEP 149

Application Thermal Derating Methodologies

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Organization: JEDEC
Publication Date: 1 January 2021
Status: active
Page Count: 18
scope:

This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such methodologies.

NOTE This publication advocates the use of derating, but leaves the amount of derating up to the user. This should vary depending on many application requirements including reliability, criticality, functional performance needs, etc. Also note that mechanical related mechanisms (such as vibration, shock, etc.) may not be suitable for derating per the methodology described here.

Document History

JEDEC JEP 149
January 1, 2021
Application Thermal Derating Methodologies
This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such...
November 1, 2004
Application Thermal Derating Methodologies
This publication applies to the application of integrated circuits and their associated packages in end use designs. It summarizes the methodology of thermal derating and the suitability of such...

References

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