scope:

This drawing documents three product assurance class levels consisting of space application (device classes Q), high reliability (device classes M and Q), and non traditional performance environment (device class N).A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.For device class N, the user is cautioned to assure that the device is appropriate for the application envirornment.

The PIN is as shown in the following example:

Device classes N, Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 80486DX-25 32 Bit High Integration Microprocessor 02 80486DX-33 32 Bit High Integration Microprocessor 03 1/ 80486DX2-50 32 Bit High Integration Microprocessor 04 1/ 80486DX2-66 32 Bit High Integration Microprocessor 05 1/ 80486DX-25 32 Bit High Integration Microprocessor 06 1/ 80486DX-33 32 Bit High Integration Microprocessor 07 1/ 80486DX2-50 32 Sit High Integration Microprocessor 08 1/ 80486DX2-66 32 Bit High Integration Microprocessor 09 1/ 80486DX2-50 32 Bit High Integration Microprocessor 10 1/ 80486DX2-66 32 Bit High Integration Microprocessor

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A N Certification and qualification to MIL-PRF-38535 with nontraditional performance environment 2/ Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline Letter Descriptive designator Terminals Package style X CMGA9-Pl68 168 Ceramic, pin grid array Y See Figure 1 196 Leaded chip carrier with

The Lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Supply voltage with respect to ground range . . . . . . . −0.5V dc to +6.5V dc Voltage on any pin with respect to ground range . . . . . −0.5v dc to +5.5V dc Maximum power dissipation (P_D) Device 01 and 05 . . . . . . . . . . . . . . . . . . . 3.675 W Device 02 and 06 . . . . . . . . . . . . . . . . . . . 4.725 W Device 03, 07, 09 . . . . . . . . . . . . . . . . . . . 4.988 W Device 04, 08, 10 . . . . . . . . . . . . . . . . . . . 6.3 W Lead temperature (soldering 10 seconds) . . . . . . . . . 300°C Thermal resistance, junction-to-case (θ_JC): Case X . . . . . . . . . . . . . . . . . . . . . . . . 1.5°C/W Case Y . . . . . . . . . . . . . . . . . . . . . . . . 2.5°C/W Maximum junction temperature (T_J) Devices 01,02,05,06: Case X (T_J) = 132.1°C; Case Y (T_J) = 136.8°C Devices 03,04,07,08: Case X (T_J) = 134.5°C; Case Y (T_J) = 140.8°C Devices 09 and 10: Case X (T_J) = 119°C; Case Y (T_J) = 125.8°C

Case operating temperature range (T_C) 01-08 . . . . . . . −55°c to +125°c Case operating temperature range (T_C) 09-10 . . . . . . . −40°C to +110°C Supply voltage, (V_CC) . . . . . . . . . . . . . . . . . . 4.75 V dc ≤ V_CC ≤ 5.25 V dc

Fault coverage measurement of manufacturing Logic tests (MIL-STD-883, test method 5012) . . . . . . . 98.5 percent

intended Use: