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IEC 61189-11

Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

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Organization: IEC
Publication Date: 1 May 2013
Status: active
Page Count: 34
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Document History

IEC 61189-11
May 1, 2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
This part of IEC 61189 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for...

References

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