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DIN EN 61190-1-2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014

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Organization: DIN
Publication Date: 1 November 2014
Status: active
Page Count: 24
ICS Code (Electronic component assemblies): 31.190
ICS Code (Brazing and soldering): 25.160.50
scope:

Dieser Teil von IEC 61190 legt die allgemeinen Anforderungen zur Beschreibung und Prüfung von Lotpasten fest, die für die Herstellung hochwertiger elektronischer Verbindungen in der Elektronikmontage verwendet werden. Diese Norm schreibt ein Qualitätsprüfungsdokument vor und soll sich nicht direkt auf das Verhalten des Materials im Herstellungsprozess beziehen.

Zugehörige Informationen zur Beschreibung und Qualitätsprüfung der Flussmittel sowie die Liefervorschriften für Flussmittel und Materialien, die Flussmittel enthalten, sind in IEC 61190-1-1 enthalten.

Document History

DIN EN 61190-1-2
November 1, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
Dieser Teil von IEC 61190 legt die allgemeinen Anforderungen zur Beschreibung und Prüfung von Lotpasten fest, die für die Herstellung hochwertiger elektronischer Verbindungen in der Elektronikmontage...
DIN EN 61190-1-2/A1
March 1, 2012
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1023/CD:2011)
A description is not available for this item.
DIN EN 61190-1-2
November 1, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2007); German version EN 61190-1-2:2007
A description is not available for this item.
DIN EN 61190-1-2
January 1, 2003
Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronic assembly (IEC 61190-1-2:2002); German version EN 61190-1-2:2002
A description is not available for this item.

References

This document references:
DIN EN 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015
Published by DIN on November 1, 2015
Dieser Teil von IEC 61189 ist ein Katalog von Prüfverfahren, die methodische Verfahren und Prüfabläufe darstellen, die bei der Prüfung bestückter Leiterplatten angewandt werden können. Dieser Teil...
This document references:
EN ISO 9454-2 - Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements
Published by CEN on November 1, 2020
This document specifies the performance requirements for fluxes in solid, liquid and paste forms intended for use with soft solders. NOTE 1 ISO 9454-1 specifies the requirements for labelling and...
This document references:
EN 60194 - Printed board design, manufacture and assembly - Terms and definitions
Published by CENELEC on July 1, 2006
A description is not available for this item.
This document references:
EN IEC 61190-1-3 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
Published by CENELEC on March 1, 2018
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
DIN EN 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015
Published by DIN on November 1, 2015
Dieser Teil von IEC 61189 ist ein Katalog von Prüfverfahren, die methodische Verfahren und Prüfabläufe darstellen, die bei der Prüfung bestückter Leiterplatten angewandt werden können. Dieser Teil...
This document is referenced by:
DIN EN 62326-20 - Printed boards - Part 20: Printed circuit boards for high-brightness LEDs (IEC 62326-20:2016); German version EN 62326-20:2016
Published by DIN on December 1, 2016
Dieser Teil von IEC 62326 legt die Eigenschaften der Leiterplatte (PCB) (en: Printed Circuit Board) für Hochleistungs-LEDs fest. Da Leiterplatten für Hochleistungs-LEDs in vielerlei Hinsicht...
This document is referenced by:
DIN EN 61191-3 - Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Published by DIN on May 1, 2018
Dieser Teil von IEC 61191 legt die Anforderungen an die Lötmontage von Baugruppen in Durchstecktechnik fest. Die Anforderungen beziehen sich auf Baugruppen, die ausschließlich in...
This document is referenced by:
DIN EN 61191-2 - Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019
Published by DIN on February 1, 2020
A description is not available for this item.
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